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Capacitive Touch Screen

Silver Ink Technology
Compared with Mo-Al-Mo and Gold Plating technology, the silver paste technology has simple production process and low cost. It is mostly used in areas where there are no high requirements for products, includingGG DITO, GFF, GF and other structures. Meanwhile, TOPLAND can provide optical bonding service with LCD module.

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产品描述
Size0.95‘’
External Size18.7x31.9

A.A.(mm)W*H

10.8x21.7

Controller

FT3267
Transmittance≥86%

Surface hardness

6H

Operating Temperature

-20℃^70℃,≤90% RH

Interface

I2C

Structure

G+F


TIAN-F00901-01图纸.jpg


其它尺寸

以下并非全部尺寸,如您需要的尺寸不在以下表格中,请联系我们告知您需要的具体尺寸

SizeExternal Size

A.A.(mm)W*H

Controller

Transmittance

Surface hardness

Operating TemperatureInterfaceStructure
0.9‘’18.7x31.910.8x21.7FT3267≥86%6H-20℃^70℃,≤90% RHI2CG+F
1.2‘’φ50.5φ31FT3268≥86%6H-20℃^70℃,≤90% RHI2CG+F
3.5‘’85.3x109.849.56x74.04GT1151Q≥86%6H-20℃^70℃,≤90% RHI2CG+F+F

4.3‘’

174.6x93.696.04x54.86GT911≥86%6H-20℃^70℃,≤90% RHI2CG+G SITO
5.6‘’137x92.1110x67FT7511≥86%6H-20℃^70℃,≤90% RHI2CG+F+F
7‘’180.59x119.1154.48x86.32FT7511≥86%6H-20℃^70℃,≤90% RHI2CG+G DITO
7‘’235x117.7152.4x95.7ILI2511≥86%6H-20℃^70℃,≤90% RHUSB+I2CG+F+F
10.1‘’257x169222.72x125.28GT928≥86%6H-20℃^70℃,≤90% RHI2CG+F+F
10.4‘’179.8x230.4160.4x213.2ILI2511≥86%6H-20℃^70℃,≤90% RHI2CG+G DITO
15‘’273.06x358.6229.1x305.1WDT8752≥86%6H-20℃^70℃,≤90% RHUSBG+G DITO
15.6‘’390x254345.16x194.59ILI2511

≥86%

6H-20℃^70℃,≤90% RHUSBG+F+F
21.5''508.1x303.18476.64x268WDT8761

≥86%

6H-20℃^70℃,≤90% RHUSBG+F+F


  • Silver Ink Technology规格书

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